Light bulb

ABSTRACT

A light bulb includes a base, a filament coupled to the base and a cover covering the filament. The filament includes a transparent structure, optoelectronic units arranged on the transparent structure in sequence, each including a side surface, a first and second bonding pad formed on a top side of one of the optoelectronic units, a third and fourth bonding pad formed on a top side of another optoelectronic unit, conductive elements, one of the conductive elements including a bottom surface directly connecting the first and third bonding pads without covering the side surfaces of the one and the another of the optoelectronic units, and a top surface opposite to the bottom surface, the transparent structure continuously covering the optoelectronic units and the conductive elements without directly contacting the top surfaces of the conductive elements, first and seconds terminal electrically connected to the optoelectronic units.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of co-pending application Ser. No.16/436,445, filed on Jun. 10, 2019, which is a Continuation ofco-pending application Ser. No. 16/110,293, now issued, filed on Aug.23, 2018, which is a Continuation of co-pending application Ser. No.15/730,323 filed Oct. 11, 2017, now issued, which is a Continuation ofapplication Ser. No. 14/933,816 filed Nov. 5, 2015, now issued, which isa Continuation of application Ser. No. 13/743,030, filed on Jan. 16,2013, now abandoned, for which priority is claimed under 35 U.S.C. §120; and this application claims priority of U.S. ProvisionalApplication No. 61/694,410 filed on Aug. 29, 2012, and U.S. ProvisionalApplication No. 61/683,295 filed on Aug. 15, 2012 under 35 U.S.C. §119(e), the entire contents of all of which are hereby incorporated byreference.

BACKGROUND OF THE INVENTION Field of the Invention

The application relates to a light-emitting device, and moreparticularly, to a light-emitting device having light-emitting units anda transparent structure having cavities configured to accommodate atleast one of the light-emitting units.

Brief Description of Related Art

Incandescent lamps are commonly used as light sources for bothresidential and commercial facilities. However, incandescent lamps areinefficient because 90% of the input energy is lost primarily in theform of heat or infrared energy. Compact fluorescent lamps (CFL) arealternative to incandescent lamps. CFL is more effective at convertingelectricity into light, but it contains toxic materials which lead toenvironmental pollution. One solution to improve the efficiency of lampsis to use solid state devices such as light-emitting diode (LED) toproduce the light.

The light-emitting diode (LED) is a solid state semiconductor device. Astructure of the light-emitting diode (LED) comprises a p-typesemiconductor layer, an n-type semiconductor layer, and a light-emittinglayer. The light-emitting layer is formed between the p-typesemiconductor layer and the n-type semiconductor layer. The structure ofthe LED generally comprises III-V group compound semiconductor such asgallium phosphide, gallium arsenide, or gallium nitride. Thelight-emitting principle of the LED is the transformation of electricalenergy to optical energy by applying electrical current to the p-njunction to generate electrons and holes. Then, the LED emits light whenthe electrons and the holes combine.

SUMMARY OF THE INVENTION

A light bulb according to an exemplary embodiment of the presentapplication comprises a base, a first filament coupled to the base and acover covering the first filament. The first filament comprises atransparent structure, a plurality of optoelectronic units arranged onthe transparent structure in a sequence configuration, each of theplurality of optoelectronic units comprising a side surface, a firstbonding pad and a second bonding pad formed on a top side of one of theplurality of optoelectronic units, a third bonding pad and a fourthbonding pad formed on a top side of another of the plurality ofoptoelectronic units, a plurality of conductive elements spaced apartfrom each other, wherein one of the plurality of conductive elementscomprises a bottom surface directly connecting the first bonding padformed on the one of the plurality of optoelectronic units and the thirdbonding pad formed on the another of the plurality of optoelectronicunits without covering the side surfaces of the one and the another ofthe plurality of optoelectronic units, and a top surface opposite to thebottom surface, wherein the transparent structure continuously coversthe plurality of optoelectronic units and the plurality of conductiveelements without directly contacting the top surfaces of the pluralityof conductive elements, a first terminal electrically connected to andlocated adjacent to a first of the plurality of optoelectronic units inthe sequence configuration without overlapping with each other and asecond terminal electrically connected to and located adjacent to a lastof the plurality of optoelectronic units in the sequence configuration.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a cross-sectional view of an optoelectronic unitdisclosed in one embodiment of the present application;

FIG. 1B illustrates a top view of the optoelectronic unit of FIG. 1Awithout showing a bonding pad;

FIG. 1C illustrates a top view of the optoelectronic unit of FIG. 1A;

FIG. 2A illustrates a cross-sectional view of an optoelectronic unitdisclosed in one embodiment of the present application;

FIG. 2B illustrates a top view of the optoelectronic unit of FIG. 2A;

FIG. 3A illustrates a cross-sectional view of an optoelectronic unitdisclosed in one embodiment of the present application;

FIG. 3B illustrates a top view of the optoelectronic unit of FIG. 3A;

FIGS. 4A-4C illustrates a manufacturing method of an optoelectronicelement disclosed in one embodiment of the present application;

FIG. 5A illustrates a cross-sectional view of an optoelectronic elementdisclosed in one embodiment of the present application;

FIG. 5B illustrates a cross-sectional view of an optoelectronic elementdisclosed in one embodiment of the present application;

FIG. 5C illustrates a cross-sectional view of an optoelectronic elementdisclosed in one embodiment of the present application;

FIG. 6A is a diagram illustrating a light-emitting device including aplurality of optoelectronic elements in accordance with an embodiment ofthe present application;

FIG. 6B illustrates a cross-sectional view of the light-emitting devicealong X-X′ line of FIG. 6A;

FIG. 6C illustrates a cross-sectional view of the light-emitting devicealong X-X′ line of FIG. 6A;

FIG. 6D illustrates a cross-sectional view of the light-emitting devicealong X-X′ line of FIG. 6A;

FIG. 6E is a diagram illustrating a light-emitting device including aplurality of optoelectronic elements in accordance with an embodiment ofthe present application;

FIG. 7 illustrates a front view of a light bulb in accordance with anembodiment of the present application;

FIGS. 8A-8B, 9A-9B, 10A-10B, 11A, 11B, 11C and 11D, 12A-12B, 13A-13B,14A-14B, 15, 16, and 17 illustrate a manufacturing method of alight-emitting device in accordance with an embodiment of the presentapplication;

FIG. 18 illustrates a top view of an optoelectronic package inaccordance with an embodiment of the present application;

FIG. 19 illustrates a cross-sectional view of a light tube in accordancewith an embodiment of the present application;

FIGS. 20A-20B illustrate an enlarged perspective view of a light tube inaccordance with an embodiment of the present application;

FIGS. 21A-21B illustrate a cross-sectional view of a light-emittingdevice in accordance with an embodiment of the present application;

FIGS. 22A-22B illustrate a cross-sectional view of a light tube inaccordance with an embodiment of the present application;

FIG. 23 illustrates a perspective view of a light bulb in accordancewith an embodiment of the present application;

FIG. 24 illustrates a perspective view of a light bulb in accordancewith an embodiment of the present application; and

FIG. 25 illustrates a perspective view of a light bulb in accordancewith an embodiment of the present application.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiment of the application is illustrated in detail, and isplotted in the drawings. The same or the similar part is illustrated inthe drawings and the specification with the same number.

FIG. 1A illustrates a cross-sectional view of an optoelectronic unit 1disclosed in one embodiment of the present application. Theoptoelectronic unit 1 has a bottom surface S1 with an area smaller than50 mil², for example, the area is about 4 mil×6 mil or 2 mil×5 mil. Theoptoelectronic unit 1 includes a substrate 101 and a light-emittingstructure 102 formed on the substrate 101. The light-emitting structure102 includes a first semiconductor layer 102 a having a firstconductivity type; a second semiconductor layer 102 c having a secondconductivity type; and a light-emitting layer 102 b formed between thefirst semiconductor layer 102 a and the second semiconductor layer 102c. The material of the light-emitting structure 102 comprises III-Vgroup semiconductor material. Depending on the material of thelight-emitting layer 102 b, the optoelectronic unit 1 is capable ofemitting a red light, a green light, or a blue light. A transparentconductive layer 108 made of a conductive material, such as indium tinoxide (ITO), cadmium tin oxide (CTO), antimony tin oxide, indium zincoxide, zinc aluminum oxide, or zinc tin oxide, is formed on thelight-emitting structure 102 for current spreading. A first bonding pad104 is formed on the passivation layer 103 and electrically connected tothe first semiconductor layer 102 a. A second bonding pad 105 is formedon the light-emitting structure 102 and electrically connected to thesecond semiconductor layer 102 c. A passivation layer 103 is formed onone or more surfaces of the light-emitting structure 102 and made of oneor more dielectric materials, such as SiO₂ or Si₃N₄. The passivationlayer 103 is used to electrically separate the first bonding pad 104 andthe second bonding pad 105 from each other. FIG. 1B illustrates a topview of the optoelectronic unit 1 without showing the first bonding pad104 and the second bonding pad 105 of FIG. 1A. FIG. 1C illustrates a topview of the optoelectronic unit 1 as shown in FIG. 1A. An area sum of atop surface 104 s of the first bonding pad 104 and a top surface 105 sof the second bonding pad 105 is at least 30% above of the area of thebottom surface S1 of the optoelectronic unit 1.

FIG. 2A illustrates a cross-sectional view of an optoelectronic unit 2disclosed in one embodiment of the present application. Theoptoelectronic unit 2 has a bottom surface S1 with an area smaller than50 mil², for example, the area is about 4 mil×6 mil or 2 mil×5 mil. Asshown in FIG. 2A, other than the parts similar to the optoelectronicunit 1, the optoelectronic unit 2 further includes a first extension pad204, a second extension pad 205, and a passivation layer 203. The firstextension pad 204 and the second extension pad 205 can be formed on thefirst bonding pad 104 and the second bonding pad 105 respectively. Thepassivation layer 203, which can be made of one or more dielectricmaterials, such as SiO₂ or Si₃N₄, is used to electrically separate thefirst extension pad 204 and the second extension pad 205 from eachother. FIG. 2B illustrates a top view of the optoelectronic unit 2 ofFIG. 2A. A top surface 204 s of the first extension pad 204 is greaterthan the top surface 104 s of the first bonding pad 104. A top surface205 s of the second extension pad 205 is larger than the top surface 105s of the second bonding pad 105. An area sum of the top surface 204 s ofthe first extension pad 204 and the top surface 205 s of the secondextension pad 205 is at least 50% above of the area of the bottomsurface S1 of the optoelectronic unit 2.

FIG. 3A illustrates a cross-sectional view of an optoelectronic unit 3disclosed in one embodiment of the present application. Theoptoelectronic unit 3 has a bottom surface S1 with an area smaller than50 mil², for example, the area is about 4 mil×6 mil or 2 mil×5 mil. Asshown in FIG. 3A, the optoelectronic unit 3 includes a substrate 101 anda light-emitting structure 102 formed on the substrate 101. The materialof the light-emitting structure 102 comprises III-V group semiconductormaterial. Depending on the material of the light-emitting layer 102 b,the optoelectronic unit 3 is capable of emitting a red light, a greenlight, or a blue light. The light-emitting structure 102 includes afirst semiconductor layer 102 a having the first conductivity type, asecond semiconductor layer 102 c having the second conductivity type,and a light-emitting layer 102 b formed between the first semiconductorlayer 102 a and the second semiconductor layer 102 c. The optoelectronicunit 3 further includes a passivation layer 103 formed on one or moresurfaces of the light-emitting structure 102 and made of one or moredielectric materials, such as SiO₂ or Si₃N₄. A transparent conductivelayer 108 made of a conductive material such as indium tin oxide (ITO),cadmium tin oxide (CTO), antimony tin oxide, indium zinc oxide, zincaluminum oxide, or zinc tin oxide, is formed on the light-emittingstructure 102 for current spreading. A first electrode pad 304 and asecond electrode pad 305 are formed on the same side of the substrate101 and electrically connected to the first semiconductor layer 102 aand the second semiconductor layer 102 c respectively. The firstelectrode pad 304 and the second electrode pad 305 are electricallyseparated from each other by the passivation layer 103. FIG. 3Billustrates a top view of the optoelectronic unit 3 of FIG. 3A. An areasum of a top surface 304 s of the first electrode pad 304 and a topsurface 305 s of the second electrode pad 305 is at least 50% above ofthe area of the bottom surface S1 of the optoelectronic unit 3.

The first bonding pad 104 and the second bonding pad 105, as shown inFIG. 1C, can function as an electrical connection path with an externalpower supply (not shown). The first extension pad 204 and the secondextension pad 205, as shown in FIG. 2B, or the first electrode pad 304and the second electrode pad 305, as shown in FIG. 3B, can havefunction(s) similar to the first bonding pad 104 and the second bondingpad 105, respectively. Taking the first bonding pad 104 as an example,if the top surface 104 s of the first bonding pad 104 is large enough,it would be easier to connect or align the optoelectronic unit 1 to theexternal structure, for example, the external power supply. The firstextension pad 204 formed on the first bonding pad 104 can furtherenlarge the connection area, such as the top surface 204 s, so that theoptoelectronic unit 2 can have even larger alignment tolerance than theoptoelectronic unit 1. Accordingly, the area of the top surface 304 s ofthe first electrode pad 304 can be approximately similar to that of thetop surface 204 s of the first extension pad 204, and the area of thetop surface 305 s of the second electrode pad 305 can also beapproximately similar to that of the top surface 205 s of the secondextension pad 205.

FIGS. 4A-4C illustrate a manufacturing method of an optoelectronicelement 4 disclosed in one embodiment of the present application. Asshown in FIG. 4A, a plurality of light-emitting units, which can be oneor more kinds of the optoelectronic unit 1, 2, or 3 described above, canbe provided on a temporary carrier 10. The material of the temporarycarrier 10 can include one of conductive material and insulatingmaterial. The conductive material includes carbonaceous material,composite material, metal, semiconductor, or any combination thereof.The carbonaceous material is such as Diamond Like Carbon (DLC), graphiteor carbon fiber. The composite material is such as Metal MatrixComposite (MMC), Ceramic Matrix Composite (CMC) or Polymer MatrixComposite (PMC). The semiconductor is such as Si, ZnSe, GaAs, SiC, GaP,GaAsP, ZnSe, InP, LiGaO₂, or LiAlO₂. The metal is such as Ni, Cu, or Al.The insulating material includes organic material, inorganic material,or any combination thereof. The organic material is such as epoxy,polyimide (PI), BCB, perfluorocyclobutane (PFCB), Su8, acrylic resin,polymethyl methacrylate (PMMA), polyethylene terephthalate (PET),polycarbonate (PC), polyetherimide, or fluorocarbon polymer. Theinorganic material is such as sapphire, ZnO, diamond, glass, quartz, orAlN.

Taking the optoelectronic unit 3 as an example, a bonding layer 12 canbe further provided to bond the plurality of light-emitting units 3 tothe temporary carrier 10. Each of the plurality of light-emitting units3 can include a light-emitting diode (LED) bare chip having a firstelectrode pad 304 and a second electrode pad 305. The bonding layer 12can include one or more adhesive materials. The adhesive material can bean insulating material, a UV tape, or a thermal release tape. Theinsulating material includes but not limited to benzocyclobutene (BCB),Su8, epoxy, or spin-on-glass (SOG).

After aforementioned steps, the light-emitting units 3 can beencapsulated by a first supporting structure 16 as shown in FIG. 4B. Thefirst supporting structure 16 can be a transparent structure, primarilyconstructed of one or more of organic material or inorganic material.The organic material is such as epoxy, polyimide (PI), BCB,perfluorocyclobutane (PFCB), Su8, acrylic resin, polymethyl methacrylate(PMMA), polyethylene terephthalate (PET), polycarbonate (PC),polyetherimide, or fluorocarbon polymer. The inorganic material is suchas glass, Al₂O₃, SINR, or SOG. The organic material or inorganicmaterial can be filled in a space 16 t between two adjacentlight-emitting units 3. The first supporting structure 16 covering thelight-emitting units 3 can hold and support the light-emitting units 3,and enhance the mechanical strength of the light-emitting units 3. Inaddition, a surface S3 of the first supporting structure 16 can be asmooth surface or a rough surface. A second supporting structure 18 isfurther formed on the first supporting structure 16 to strengthen thesupport of the optoelectronic unit 3 and the first supporting structure16. The second supporting structure 18 can be a transparent structureincluding one material different from that of the first supportingstructure 16, or has hardness greater than that of the first supportingstructure 16.

As shown in FIG. 4C, the temporary carrier 10 and the bonding layer 12are removed to expose portions of the plurality of light-emitting units3 and the first supporting structure 16 after the first supportingstructure 16 or the second supporting structure 18 is formed. Aplurality of conductive structures 40, which are located on a position(not shown) opposite to the second supporting structure 18, are thenformed on the exposed portions of the plurality of light-emitting units3 and the first supporting structure 16. The conductive structure 40 canbe connected to the first electrode pad 304 and the second electrode pad305 of the light-emitting units 3 respectively. Each conductivestructure 40 has a top surface area (not shown) greater than either ofthe first bonding pad 104 and the second bonding pad 105 of FIG. 1C, orgreater than or equal to either of the first extension pad 204 and thesecond extension pad 205 of FIG. 2B, or greater than or equal to eitherof the first electrode pad 304 and the second electrode pad 305 of FIG.3B. Finally, the plurality of optoelectronic elements 4 is separatedfrom each other by dicing along openings 17, as shown in FIG. 4C. Atleast one of the length, the width and the area of the optoelectronicelement 4 is within the same order of the optoelectronic unit 1, 2, or3.

FIG. 5A illustrates a cross-sectional view of an optoelectronic element4 a. The optoelectronic element 4 a includes an optoelectronic unit 1, afirst supporting structure 16 formed on the optoelectronic unit 1, and asecond supporting structure 18 formed on the first supporting structure16. Preferably, the first supporting structure 16 can be formed in ashape surrounding the optoelectronic unit 1. A first conductivestructure 401 and a second conductive structure 402 are formed on theoptoelectronic unit 1, and respectively connected to the first bondingpad 104 and the second bonding pad 105 of the optoelectronic unit 1. Atop surface area 401 s of the first conductive structure 401 is largerthan the top surface 104 s of the first bonding pad 104, and a topsurface area 402 s of the second conductive structure 402 is larger thanthe top surface 105 s of the second bonding pad 105. The passivationlayer 103, which is disposed on the light-emitting structure 102, canisolate the first bonding pad 104 and the second bonding pad 105, andprotect the light-emitting structure 102. A reflective layer 280 can beformed on the optoelectronic unit 1 and the first supporting structure16. The reflective layer 280 can be made of one or more reflectivematerials, such as dielectrically material, for example, SiO₂, Si₃N₄, ormetal oxide, such as titanium dioxide or other white substance. In anexample of the present application, the reflective layer 280 can be asingle layer or a stack. A ratio of a volume of the optoelectronicelement 4 a and a volume of the optoelectronic unit 1 is between 1.2:1and 10:1, preferably between 2:1 and 5:1. The second supportingstructure 18 has a first width W1. The optoelectronic unit 1 has asecond width W2. The first width W1 is larger than the second width W2,for example, the first width W1 is at least 1.5 times the second widthW2. The first distance d1 between the first bonding pad 104 and thesecond bonding pad 105 is larger than the third distance d3 between thefirst conductive structure 401 and the second conductive structure 402.

FIG. 5B illustrates a cross-sectional view of an optoelectronic element4 b. The optoelectronic element 4 b includes an optoelectronic unit 2, afirst supporting structure 16 formed on the optoelectronic unit 2, and asecond supporting structure 18 formed on the first supporting structure16. The first supporting structure 16 can be formed in a shapesurrounding the optoelectronic unit 2. A first conductive structure 401and a second conductive structure 402 are formed on the optoelectronicunit 2, and connected to the first extension pad 204 and the secondextension pad 205, respectively. A reflective layer 280 can be formed onthe optoelectronic unit 2 and the first supporting structure 16. Thereflective layer 280 can be made of one or more reflective materials,such as dielectrically material, for example, SiO₂, Si₃N₄, or metaloxide, such as titanium dioxide or other white substance. In an exampleof the present application, the reflective layer 280 can be a singlelayer or a stack. The first conductive structure 401 has a top surfacearea 401 s larger than or equal to a top surface area 204 s of the firstextension pad 204, and the second conductive structure 402 has a topsurface area 402 s larger than or equal to a top surface area 205 s ofthe second extension pad 205. A ratio of a volume of the optoelectronicelement 4 b and a volume of the optoelectronic unit 2 is between 1.2:1and 10:1, preferably between 2:1 and 5:1. The second supportingstructure 18 has a first width W1, and the optoelectronic unit 2 has asecond width W2. The first width W1 is larger than the second width W2,for example, the first width W1 is at least 1.5 times the second widthW2. A first distance d1 between the first bonding pad 104 and the secondbonding pad 105 is larger than a second distance d2 between the firstextension pad 204 and the second extension pad 205, and further largerthan a third distance d3 between the first conductive structure 401 andthe second conductive structure 402. However, FIG. 5B is onlyillustrative but not limitative. In an example of the presentapplication, the second distance d2 can be equal to, larger, or smallerthan the third distance d3.

FIG. 5C illustrates a cross-sectional view of an optoelectronic element4 c. The optoelectronic element 4 c includes an optoelectronic unit 3, afirst supporting structure 16 formed on the optoelectronic unit 3, and asecond supporting structure 18 formed on the first supporting structure16. The optoelectronic unit 3 can be surrounded by the first supportingstructure 16. A first conductive structure 401 and a second conductivestructure 402 are formed on the optoelectronic unit 3, and connected tothe first electrode pad 304 and the second electrode pad 305,respectively. A reflective layer 280 can be formed on the optoelectronicunit 3 and the first supporting structure 16. The reflective layer 280can be made of one or more reflective materials, such as dielectricallymaterial, for example, SiO₂, Si₃N₄, or metal oxide, such as titaniumdioxide or other white substance. The first conductive structure 401 hasa top surface area 401 s larger than or equal to a top surface area 304s of the first electrode pad 304, and the second conductive structure402 has a top surface area 402 s larger than or equal to a top surfacearea 305 s of the second electrode pad 305. A ratio of a volume of theoptoelectronic element 4 c and a volume of the optoelectronic unit 3 isbetween 1.2:1 and 10:1, preferably between 2:1 and 5:1. The secondsupporting structure 18 has a first width W1 and the optoelectronic unit3 has a second width W2. The first width W1 is larger than the secondwidth W2, for example, the first width W1 is at least 1.5 times thesecond width W2. A distance d4 between the first electrode pad 304 andthe second electrode pad 305 is larger than or equal to a third distanced3 between the first conductive structure 401 and the second conductivestructure 402. However, FIG. 5C is only illustrative but not limitative.

FIG. 6A illustrates a light-emitting device 5 a in accordance with anembodiment of the present application. The light-emitting device 5 acomprises a supporting structure 51. In one embodiment, the supportingstructure 51 can be an opaque structure or a transparent structurehaving an average light transmittance above 60%, preferably above 70%between visible light regions. The material of the transparent structurecomprises organic material, inorganic material, or both thereof. Theorganic material comprises plastics. The inorganic material comprisesglass, quartz, Al₂O₃, diamond, or the combination thereof. In anotherembodiment, the supporting structure 51 can be a flexible structurecomprising flexible material, such as flexible glass or flexibleplastics, and the flexible structure can be bent into any shape toachieve a desired emission pattern. In another embodiment, thesupporting structure 51 is thermally stable and has a heat resistance. Amelting point of the supporting structure 51 is higher than an operationtemperature of the light-emitting device 5 a. The heat generated duringthe operation of the light-emitting device 5 a does not deform or meltdown the supporting structure 51.

One or more kinds of the optoelectronic unit 1, 2, or 3, or theoptoelectronic elements 4 a, 4 b, or 4 c described above can be appliedto the light-emitting device 5 a and formed on the supporting structure51 with conductive material or non-conductive material. The conductivematerial comprises metal or metal oxides such as indium tin oxide (ITO),cadmium tin oxide (CTO), antimony tin oxide, indium zinc oxide, zincaluminum oxide, or zinc tin oxide. The non-conductive material comprisesepoxy, polyimide (PI), BCB, perfluorocyclobutane (PFCB), Sub,polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide, orfluorocarbon polymer. In another embodiment, the optoelectronic unit 1,2, or 3, or the optoelectronic elements 4 a, 4 b, or 4 c can also beformed on the supporting structure 51 with an anisotropic conductivefilm (ACF).

If the supporting structure 51 is transparent, one or more kinds of theoptoelectronic unit 1, 2, or 3, or the optoelectronic element 4 a, 4 b,or 4 c described above can be embedded into the supporting structurewith the manufacturing method described in FIGS. 4A-4C. In anotherembodiment, a plurality of bonding pads such as solder bumps can beformed on a top surface of the supporting structure at pre-determinedpositions, and one or more kinds of the optoelectronic unit 1, 2, or 3,or the optoelectronic element 4 a, 4 b, or 4 c described above can beflipped and bonded to the plurality of bonding pads.

If the supporting structure 51 is opaque, a plurality of bonding padssuch as solder bumps can be formed on a top surface of the supportingstructure at pre-determined positions, and one or more kinds of theoptoelectronic unit 1, 2, or 3, or the optoelectronic element 4 a, 4 b,or 4 c described above can be flipped and bonded to the plurality ofbonding pads.

FIG. 6A illustrates an example of the light-emitting units 3 beingembedded in the supporting structure 51. In the embodiment, thelight-emitting device 5 a includes a plurality of light-emitting units 3embedded in the supporting structure 51, wherein the supportingstructure 51 is a transparent structure with one or more cavities (notshown) accommodating the plurality of optoelectronic unit 3. As shown inFIG. 6A, the plurality of light-emitting units 3 is electrically coupledtogether in a series connection by a conductive element 53, wherein thematerial of the conductive element 53 can be metal. The conductiveelement 53 has a portion 531 arranged on the supporting structure 51between two of the cavities. The conductive element 53 can be made bymetal wiring, chemical deposition, or electrical plating.

If one or more kinds of the light-emitting units 1, 2, or 3 describedabove are applied to the light-emitting device 5 a, a first conductivestructure and a second conductive structure can be optionally formed onthe light-emitting units 1, 2, or 3 to enlarge alignment tolerancebetween the conductive element 53 and the light-emitting units 1, 2, or3. In the embodiment shown in FIG. 6A, one optoelectronic unit 3 isembedded in one cavity, a first conductive structure 501 and a secondconductive structure 502 are respectively formed on the first electrodepad 304 and the second electrode pad 305, shown in FIG. 3A, of theoptoelectronic unit 3, and the conductive element 53 forms a circuitelectrically connecting the first conductive structure 501 of oneoptoelectronic unit 3 with the second conductive structure 502 ofanother optoelectronic unit 3.

If one or more kinds of the optoelectronic element 4 a, 4 b, or 4 cdescribed above are applied to the light-emitting device 5 a, theconductive element 53 can form a circuit electrically connecting thefirst conductive structure 401, shown in FIGS. 5A-5C, of oneoptoelectronic element 4 a, 4 b, or 4 c with the second conductivestructure 402, shown in FIGS. 5A-5C, of another optoelectronic element 4a, 4 b, or 4 c.

After that, the conductive element 53 can be used to form a circuitelectrically connecting the optoelectronic unit 1, 2, or 3, or theoptoelectronic element 4 a, 4 b, or 4 c. The circuit has a firstterminal 55 and a second terminal 57 arranged on one end of thesupporting structure 51 to be electrical contact points, which aredenoted by symbols of ‘+’ and ‘-’, and can be electrically connected toa power supply (not shown).

FIG. 6B illustrates a cross-sectional view of the light-emitting device5 a having the optoelectronic unit 3 along X-X′ line shown in FIG. 6A. Atransparent structure, such as a bonding layer 52, including onewavelength converting material, such as yellow phosphor or dye, can beformed between the supporting structure 51 and the optoelectronic unit3. As shown in FIG. 6B, the conductive elements 53 are formed on thefirst conductive structure 501 and the second conductive structure 502to electrically connected with the optoelectronic unit 3 with the methoddescribed above.

In accordance with several embodiments of the present application, thesupporting structure 51 can have one flat surface, such as the surfaceS5 shown in FIG. 6B, or at least one rough surface having a protrusion,such as the surface S7 shown in FIG. 6C, or a curved surface S9 shown inFIG. 6D. As shown in FIG. 6C, the surface S7 can have a zigzagconfiguration. As shown in FIG. 6D, the curved surface S9 can have ahemispherical contour.

FIG. 6E illustrates a light-emitting device 5 c in accordance with afurther embodiment of the present application. One or more kinds of theoptoelectronic unit 1, 2, 3, the optoelectronic elements 4 a, 4 b, or 4c described above can be applied to the light-emitting device 5 c.Taking the optoelectronic unit 3 as an example, the light-emittingdevice 5 c includes a plurality of light-emitting units 3 which can beelectrically coupled together in series, parallel, or a combinationthereof by the conductive element 53. For example, severallight-emitting units 3 are firstly connected to form a series array, andtwo or more series arrays are electrically connected to form a parallelarray. Moreover, two or more parallel arrays are coupled with each otherin series, as shown in FIG. 6E. In details, the conductive element 53 iselectrically connected to the first conductive structure 501 and thesecond conductive structure 502 of each optoelectronic unit 3.Therefore, the light-emitting units 3 are connected with each other bythe conductive element 53. In addition, heat generated by theoptoelectronic elements can be dissipated via the conductive element 53.

Taking the plurality of optoelectronic unit 3 as an example in oneembodiment, which is not intended to limit the scope of the presentapplication, and other examples, such as the plurality of optoelectronicunit 1, 2, the plurality of optoelectronic elements 4 a, 4 b or 4 c, canbe applied in the same method. In the embodiment, the plurality ofoptoelectronic unit 3 is separated from each other at an appropriatespacing, and optionally arranged in a cluster configuration. The spacingbetween the light-emitting units 3 can be fixed, non-fixed, or variable.The spacing between the light-emitting units 3 near the circumstance ofthe supporting structure 51 is larger than that of the light-emittingunits 3 near the center of the supporting structure 51 from the diagramof the light-emitting device 5 a shown in FIG. 6A or the light-emittingdevice 5 c shown in FIG. 6E. The more the light-emitting units 3 areused, and the brighter the light-emitting device 5 a or 5 c is. As shownin FIG. 6A or FIG. 6E, the plurality of light-emitting units 3 isarranged in a shape of a perspective view, including but not limited to,a blade type, a linear type, a dispersive type, or a combinationthereof. In one embodiment, the supporting structure 51 comprises a roothaving the first terminal 55 and the second terminal 57, a stemconnected to the root and extended along a first direction, and aplurality of branches connected to the stem and extended along one ormore directions different from the first direction.

The light-emitting device 5 a or 5 c of the present application can beconstructed and arranged for different uses, for example, light bulb,emergency light, PAR light, automotive light, street lighting, subwaylighting or indoor lighting. FIG. 7 illustrates a front view of a lightbulb 6 in accordance with an embodiment of the present application. Oneor more kinds of the light-emitting device 5 a and 5 c described abovecan be applied to the light bulb 6. Taking the light-emitting device 5 aas an example, the light bulb 6 includes one light-emitting device 5 a,a socket 65 electrically connected to the light-emitting device 5 a, acontact member 64, and a cover 62. The light-emitting devices 5 a can bea tube having a dispersive configuration or a linear arrangement. Thedispersive configuration is such as blade-like shape, flower-like shape,branch-like shape, vein-like shape, cylinder shape, U-shape, or arcshape. The linear arrangement is such as a rectangular shape. Thelight-emitting device 5 a can be plugged into the socket 65. In thesocket 65, there are circuits for electrically connecting thelight-emitting device with an electrical power (not shown). The cover 62can be formed in a shape such as globe, tube, or candle. The cover 62also can be formed in a shape referred to American National StandardInstitute (ANSI) standards, such as A series, B series, S series, Fseries, and G series. The material of the cover 62 comprises glass orplastic. An air, a transparent material, or both thereof can be filledin the cover 62. The contact member 64 has a screw thread 63 and a basepin 66 which are functioned as two terminals for connecting with an ACpower (not shown). Moreover, the screw thread 63 can be also used tofasten the light bulb 6 into a socket (not shown). The contact member 64can be configured to fit within and electrically contact with a standardelectrical socket such as E40 socket, E27 socket, E26 socket, and E14socket. The contact member 64 can accommodate a driver (not shown)having circuits for rectification, and overload protection.

FIGS. 8A-15 illustrate steps of manufacturing a light-emitting device 7f shown in FIG. 16 or a light-emitting device 7 g shown in FIG. 17 inaccordance with embodiments of the present application. In FIGS. 8A-15,the optoelectronic unit 3 is referred in the following description, butone or more kinds of the light-emitting units 1, 2, or 3, or theoptoelectronic elements 4 a, 4 b, or 4 c described above can be appliedto the steps. FIG. 8A illustrates a top view of a plurality oflight-emitting units 3 formed on a temporary substrate 70. FIG. 8Billustrates a cross-sectional view along line Y-Y′ in FIG. 8A. As shownin FIGS. 8A and 8B, several light-emitting units 3 with a firstelectrode pad 304 and a second electrode pad 305 formed thereon can beformed on the temporary substrate 70 with a first pitch P1. In anotherembodiment, the light-emitting units 3 can be grown on a growthsubstrate with a first pitch P1. The light-emitting units 3 aretransferred to a temporary carrier 100. In details, the light-emittingunits 3 can be transferred from the temporary substrate 70 topredetermined positions of the temporary carrier 100 by manual pick-upor mechanical pick-up. Specifically, the light-emitting units 3 can alsobe transferred to the temporary carrier 100 by an adhesive material.Moreover, the light-emitting units 3 can be transferred one by one, orin a batch.

FIG. 9A illustrates a top view of a plurality of light-emitting units 3formed on a temporary carrier 100 in accordance with an embodiment ofthe present application. FIG. 9B illustrates a cross-sectional viewalong line Z-Z′ shown in FIG. 9A. FIG. 9B illustrates that thelight-emitting units 3 are transferred to the temporary carrier 100 froma temporary substrate 70 or the growth substrate in accordance withanother embodiment of the present application. The temporary carrier 100includes a material similar to that mentioned in the paragraph of thetemporary carrier 10. In an embodiment, the temporary carrier 100 can bea tape including one or more adhesive materials to connect thelight-emitting units 3. The light-emitting units 3 with a firstelectrode pad 304 and a second electrode pad 305 formed thereon areformed on the temporary carrier 100 with the second pitch P2 which islarger than the first pitch P1.

FIG. 10A illustrates a top view of light-emitting units 3 having a firstelectrode pad 304 and a second electrode pad 305 formed on a firstsupporting structure 73 in accordance with an embodiment of the presentapplication. FIG. 10B illustrates a cross-sectional view along line A-A′shown in FIG. 10A. The first supporting structure 73 can be made havingcavities configured to accommodate at least one of the light-emittingunits 3. The first supporting structure 73 covering the light-emittingunits 3 can hold and support the light-emitting units 3 and enhance themechanical strength of the light-emitting units 3. The first supportingstructure 73 can be a transparent structure made of one or moretransparent materials. The transparent material can be made of one ormore of organic material or inorganic material. The organic material issuch as epoxy, polyimide (PI), BCB, perfluorocyclobutane (PFCB), Su8,acrylic resin, polymethyl methacrylate (PMMA), polyethyleneterephthalate (PET), polycarbonate (PC), polyetherimide, or fluorocarbonpolymer. The inorganic material is such as glass, Al₂O₃, SINR, or SOG.As shown in FIG. 10A, a wavelength converting layer 111 can be formedaround each optoelectronic unit 3. In one embodiment, a wavelengthconverting layer 111′ can be formed in a stripe shape, and thewavelength converting layer 111′ is formed around each optoelectronicunit 3 and on part of a surface 100 s of the temporary carrier 100. Inanother embodiment, the wavelength converting layer can be formed aroundeach optoelectronic unit 3 and on the whole surface 100 s of thetemporary carrier 100.

FIG. 11A illustrates a top view of several light-emitting units 3 with afirst electrode pad 304 and a second electrode pad 305 formed thereonfurther supported by a second supporting structure 71 in accordance withan embodiment of the present application. FIG. 11B illustrates across-sectional view along line B-B′ shown in FIG. 11A. The secondsupporting structure 71 can include one material different from that ofthe first supporting structure 73, or have hardness greater than that ofthe first supporting structure 73. The second supporting structure 71can be made of one or more transparent materials, such as sapphire,diamond, glass, epoxy, quartz, acryl, SiO_(x), Al₂O₃, ZnO, silicone, orany combination thereof. A thickness of the second supporting structure71 can be between 100 μm and 700 μm. In addition, the second supportingstructure 71 can also be transparent to light, like the sunlight. Inaddition, a wavelength converting layer 111 is formed around eachoptoelectronic unit 3. At least one surface of the second supportingstructure 71 is a flat surface, such as the surface S2 shown in FIG.11B; or a rough surface, such as the surface S4 shown in FIG. 11C; orthe curved surface S6 shown in FIG. 11D. The surface S4 of the firstsupporting structure 73 is a zigzag surface. The curved surface S6 ofthe first supporting structure 73 has several curved protrusionsrespectively corresponding to the light-emitting units 3.

FIG. 12A illustrates a top view of several light-emitting units 3supported by a second supporting structure 71 and a first supportingstructure 73 in accordance with an embodiment of the presentapplication. After the optoelectronic unit 3 is removed from a temporarycarrier 100 shown in FIG. 11B, the second supporting structure 71 andthe first supporting structure 73 are flipped. FIG. 12B illustrates across-sectional view along the line C-C′ shown in FIG. 12A.

FIG. 13A and FIG. 14A illustrate top views of the light-emitting units 3electrically connected by a conductive element 75 in series. Inaccordance with another embodiment, the light-emitting units 3 can beelectrically connected by the conductive element 75 in parallel. FIG.13B and FIG. 14B illustrate cross-sectional views along the line D-D′shown in FIG. 13A and the line E-E′ shown in FIG. 14A, respectively. Asshown in FIG. 13A and FIG. 14A, the conductive element 75 has a portion751 arranged on the first supporting structure 73 between two of thelight-emitting units 3. A reflective layer 115 is formed on theoptoelectronic unit 3 by a lithography process and an etching process.The reflective layer 115 can be made of one or more reflectivematerials, such as dielectrically material, for example, SiO₂, Si₃N₄, ormetal oxide, such as titanium dioxide or other white substance. In anexample of the present application, the reflective layer 115 can be asingle layer or a stack. FIGS. 13A-13B illustrate an embodiment that apart surface S8 of the first supporting structure 73 is covered by thereflective layer 115, a part of surface S9 of the first supportingstructure 73 not covered by the reflective layer 115 is overlaid by awavelength converting layer 111″, and a part of surface S10 of the firstsupporting structure 73 not covered by the reflective layer 115 and thewavelength converting layer 111″ is overlaid by the conductive element75. The reflective layer 115 is formed on the first supporting structure73 between two of the light-emitting units 3. The materials of thewavelength converting layer 111″ and the wavelength converting layer 111can be the same or different. The material of the conductive element 75includes one or more metals. The metal is such as Ag, Au, Ti, or Cu.

FIGS. 14A-14B illustrate another embodiment that a part of the surfaceS8 of the first supporting structure 73 is covered by the reflectivelayer 115, and a part of surface S10 of the first supporting structure73 not covered by the reflective layer 115 is overlaid by the conductiveelement 75.

After the steps illustrated in FIGS. 8A-14B are finished, thelight-emitting units 3 are electrically connected with each other inseries by the conductive element 75, as shown in FIG. 15. In anotherembodiment, the light-emitting units 3 can be electrically connectedwith each other in parallel (not shown) by the conductive element 75. Asshown in FIG. 15, a first terminal 76 and a second terminal 78 areformed on the same end of a first supporting structure 73 as electricalcontact points. In another example of the embodiment, the first terminal76 and the second terminal 78 can be formed on opposite ends of thefirst supporting structure 73 as electrical contact points. Afterforming the first terminal 76 and the second terminal 78, thelight-emitting units 3 connected by the conductive element 75 areseparated into several light-emitting devices 7 f, as shown in FIG. 16.However, the number of the light-emitting units 3 can be adjusteddepending on the application. The light-emitting units 3 can be disposedin single line or multiple lines, for example, two lines as shown inFIG. 16. At least one of the light-emitting devices 7 f has a width Wand a length L. The width W is approximately between 100 μm and 1000 μm.The length L depends on the amount of the connected light-emitting units3. The more the connected optoelectronics units are, the longer thelength L is.

In another embodiment of the present application, the first terminal 76and the second terminal 78 are formed on opposite ends of the firstsupporting structure 73 as electrical contact points, as shown in FIG.17. The light-emitting units 3 are disposed in single line. At least oneof light-emitting devices 7 g has a width W and a length L. For example,the width W is approximately between 100 μm and 1000 μm. The length Ldepends on the amount of the connected light-emitting units 3. The morethe connected optoelectronics units 3 are, the longer the length L is.

The light-emitting device 7 f or 7 g of the present application can beconstructed and arranged for different uses, for example, light bulb,emergency light, PAR light, automotive light, street lighting, subwaylighting or indoor lighting. In accordance with an embodiment of thepresent application, the light-emitting device 7 f or 7 g can be appliedto a bulb, such as the light bulb 6 shown in FIG. 7. Specifically, thelight-emitting device 7 f or 7 g can be plugged into the socket 65 ofthe light bulb 6.

In accordance with another embodiment of the present application,several light-emitting device 7 f or 7 g can be electrically connectedwith each other in a linear type. Taking the light-emitting device 7 gas an example, FIG. 18 illustrates that the light-emitting devices 7 gcan be further mounted on a circuit board 72, such as a FR4 PCB. Theassembly of the light-emitting devices 7 g and the circuit board 72 isdesignated as a light-emitting device 80. The circuit board 72 caninclude a plurality of electrical connecting points 79 for connectingwith an AC power (not shown). The first terminal 76 and the secondterminal 78 are connected to the electrical connecting points 79 to formelectrical connection.

The light-emitting device 80 can be applied to a light tube 8. FIG. 19illustrates a cross-sectional view of a light tube 8. The light tube 8can have a size compatible with standard fluorescent tube, such as T5and T8 fluorescent tube. The light tube 8 can include at least onelight-emitting device 80, which is connected to a contact member (notshown) having a driver inside for electrical connection with anelectrical power source (not shown). The driver (not shown) inside thecontact member includes circuits for electrical rectification andoverload protection.

FIG. 20A illustrates an enlarged perspective view of an example of alight tube 90 in accordance with an embodiment of the presentapplication. The example of FIG. 20A illustrates the light tube 90having a cylinder shape. The light tube 90 comprises a hollow chamber905, a light-emitting device 90R capable of emitting a red light and twolight-emitting devices 90W capable of emitting a white light. Thelight-emitting device 90R and the light-emitting device 90W are disposedwithin the hollow chamber 905. The hollow chamber 905 comprisesrectangular shape, cylinder shape, U-shape, or arc shape. The hollowchamber 905 can be filled with air or transparent medium such assilicone or epoxy. Depending on the actual requirement, numbers of thelight-emitting device 90W and the light-emitting device 90R can bevaried to obtain a desired color temperature. The light-emitting device90R and the light-emitting device 90W are arranged around a central axis(A) and parallel to each other. In FIGS. 20A-20B, the optoelectronicunit 3 is referred in the following description, but one or more kindsof the light-emitting units 1, 2, or 3, or the optoelectronic elements 4a, 4 b, or 4 c described above can be applied to the light-emittingdevice 90R and the light-emitting device 90W. Each of the light-emittingdevice 90R and the light-emitting device 90W has a structure similar tothat of the light-emitting device 7 g or 7 f shown in FIGS. 16-17. Thelight-emitting device 90R or the light-emitting device 90W comprises aplurality of light-emitting units 3 connected in series to each other. Amanufacture method of the light-emitting device 90R and thelight-emitting device 90W can be referred to the embodiments illustratesin FIGS. 8A-17. In this embodiment, the light-emitting device 90Wcomprises a plurality of light-emitting units 3 capable of emitting ablue light, and a wavelength converting layer directly formed on thelight-emitting units 3 to convert the blue light to a yellow light. Theblue light is mixed with the yellow light to produce a white light. Thelight tube 90 can be configured to mix light. Specifically, the whitelight emitted from the light-emitting device 90W and having a CRI valueless than 80 is mixed with the red light emitted from the light-emittingdevice 90R for obtaining a white light having a CRI value greater than80. In this embodiment, since the light-emitting device 90W and thelight-emitting device 90R are separated from each other, the heatconduction between the light-emitting device 90W and the light-emittingdevice 90R can be reduced. The material of the light tube 90 comprisesglass, silica gel, PMMA, PU, or epoxy. Furthermore, since thelight-emitting device 90W and the light-emitting device 90R areseparated from each other, the light-emitting device 90W and thelight-emitting device 90R can be separately controlled in two channelsby an IC circuit. Two channels indicate the light-emitting device 90Wand the light-emitting device 90R are configurable to be driven underthe same or different current. For example, when the light-emittingdevice 90W is driven under 30 mA, the light-emitting device 90R can beoptionally driven under 30 mA or 20 mA. Alternatively, thelight-emitting device 90W and the light-emitting device 90R can beconnected in series and controlled in one channel through a circuitdesign on a circuit board. One channel indicates the light-emittingdevice 90W and the light-emitting device 90R are driven under the samecurrent. For example, when the light-emitting device 90W is driven under20 mA, the light-emitting device 90R is also driven under 20 mA.

FIG. 20B illustrates an enlarged perspective view of another example ofa light tube 90. In the example, the light tube 90 comprises onelight-emitting device 90R capable of emitting a red light and twolight-emitting devices 90B capable of emitting a blue light. A filmlayer 907 comprising wavelength converting materials and diffusingparticles is formed on an inner surface of the light tube 90.Alternatively, the film layer 907 can be formed on an outer surface ofthe light tube 90. The wavelength converting materials are adopted forconverting the blue light emitting from the light-emitting device 90Binto a yellow light. The blue light is mixed with the yellow light toproduce a white light. The diffusing particles are adopted for diffusingthe blue light, the yellow light and/or the white light. The white lightmixed by the blue light and the yellow light usually has a CRI valueless than 80, and then is further mixed with the red light emitted fromthe light-emitting device 90R for obtaining a white light having a CRIvalue greater than 80. In one embodiment, the film layer 907 comprisesthe wavelength converting materials for converting light and diffusinglight.

FIG. 21A illustrates a cross-sectional view of a light-emitting device90R. As shown in FIG. 21A, the light-emitting device 90R has a structuredifferent from the example of the light-emitting device 90R shown inFIG. 20A. In FIGS. 21A-21B, the optoelectronic unit 3 is referred in thefollowing description, but one or more kinds of the light-emitting units1, 2, or 3, or the optoelectronic elements 4 a, 4 b, or 4 c describedabove can be applied to the light-emitting device 90R. As shown in FIG.21A, the light-emitting device 90R comprises the optoelectronics units 3disposed on a circuit board 91 and a cover 903 disposed over thelight-emitting units 3 for guiding or scattering light. Thelight-emitting device 90R in the example of FIG. 20A has an emanatingside E1 perpendicular to the central axis (A). The light-emitting device90R in the example of FIG. 21A illustrates that the light-emittingdevice 90R has an emanating side E2 parallel to the central axis (A)shown in FIG. 20A. FIG. 21B illustrates a cross-sectional view ofanother example of the light-emitting device 90R. As shown in FIG. 21B,the cover 903 can be roughed at the side surfaces 9031 for improvinglight extraction in another example of the embodiment.

FIG. 22A illustrates a perspective view of an example of a light tube 95in accordance with an embodiment of the present application. FIG. 22Aillustrates an example that the light tube 95 have a U-shape. As shownin FIG. 22A, the light tube 95 comprises a light-transmissive cover 951,and the light-emitting device 90B capable of emitting a blue light anddisposed within the light-transmissive cover 951. In FIGS. 22A-22B, theoptoelectronic unit 3 is referred in the following description, but oneor more kinds of the light-emitting units 1, 2, or 3, or theoptoelectronic elements 4 a, 4 b, or 4 c described above can be appliedto the light-emitting device 90B. As shown in FIG. 22A, thelight-emitting device 90B comprises a plurality of light-emitting units3 connected in series to each other and formed on a flexible transparentsubstrate 953 and are electrically connected in series with each othervia a connecting structure 954 such as wire. In one embodiment, the bentlight tube 95 can comprise the light-emitting device 90B capable ofemitting a blue light and the light-emitting device 90R capable emittinga red light. In addition, a film layer 952 can be formed on an innersurface and/or an outer surface of the light-transmissive cover 951. Thefilm layer 952 comprises wavelength converting materials and diffusingparticles. The wavelength converting materials are adopted forconverting the blue light into a yellow light. The blue light is mixedwith the yellow light to produce a white light. The diffusing particlesare adopted for diffusing the blue light, the yellow light and/or thewhite light. The white light mixed by the blue light and the yellowlight usually has a CRI value less than 80, and then is further mixedwith the red light emitted from the red light-emitting units forobtaining a white light having a CRI value greater than 80. In oneembodiment, the film layer 952 comprises the wavelength convertingmaterials for converting light and diffusing light.

FIG. 22B illustrates a perspective view of another example of a lighttube 95. As shown in FIG. 22B, a plurality of the light-emitting devices90B can be mounted on a U-shaped flexible substrate 956. The flexiblesubstrate 956 has a circuit (not shown) thereon for electricallyconnecting the light-emitting devices 90B. The structure oflight-emitting devices 90B comprising a plurality of light-emittingunits, for example, the optoelectronic unit 3 described aboveelectrically connected in series to each other is similar to thestructure of the light-emitting device 7 g or 7 f shown in FIGS. 16-17.

FIG. 23 illustrates a perspective view of a light bulb 20 in accordancewith an embodiment of the present application. The light bulb 20comprises three bent light tubes 95 (U-shaped).

FIG. 24 illustrates a perspective view of a light bulb 10 in accordancewith an embodiment of the present application. The light bulb 10comprises a bulb cover 10S, a circuit board 91 such as PCB, a pluralityof sockets 98 mounted on and electrically connected with the circuitboard 91, and a plurality of light tubes 90 detachably coupled to thecorresponding socket 98. The light tubes 90 are arranged in a triangularpattern and tilted to each other. Specifically, the light tubes 90 arearranged in a cone shape viewed from perspective. Since the socket 98has a tilted top surface, the light tube 90 connected into the tiltedtop surface has a tilted position. Therefore, top portions 901 of thelight tubes 90 are close to each other and bottom portions 902 of thelight tubes 90 are far away from each other. Alternatively, top portions901 of the light tubes 90 can be far away from each other and bottomportions 902 of the light tubes 90 are close to each other. In oneembodiment, the light tubes 90 can be arranged in a polygon pattern suchas a square or a hexagon and emit light outwardly. The light tubes 90can also be arranged parallel to each other.

FIG. 25 illustrates a perspective view of a light bulb 30 in accordancewith an embodiment of the present application. The light bulb 30comprises a candle light cover 301, a circuit board 91 such as PCB, aplurality of sockets 98 mounted on and electrically connected with thecircuit board 91, and a plurality of light-emitting devices 90W capableof emitting a white light detachably coupled to the corresponding socket98. The light-emitting devices 90W are arranged in a triangular patternand tilted to each other. In this embodiment, since the socket 98 has atilted top surface, the light-emitting devices 90W connected into thetilted top surface has a tilted position. Therefore, top portions of thelight-emitting devices 90W can be close to each other and bottomportions of the light-emitting devices 90W are far away from each other.Alternatively, top portions of the light-emitting devices 90W can be faraway from each other and bottom portions of the light-emitting devices90W are close to each other. In one embodiment, the light-emittingdevices 90W can be arranged parallel to each other. The light-emittingdevices 90W can be arranged in a polygon pattern such as a square or ahexagon and emit light outwardly. The light-emitting device 90W can alsobe arranged parallel to each other. In this embodiment, thelight-emitting device 90W has a structure similar to that of thelight-emitting device 7 g or 7 f shown in FIGS. 16-17.

The principle and the efficiency of the present application illustratedby the embodiments above are not the limitation of the application. Anyperson having ordinary skill in the art can modify or change theaforementioned embodiments. Therefore, the protection range of therights in the application will be listed as the following claims.

The invention claimed is:
 1. A light bulb, comprising: a base; a firstfilament coupled to the base, comprising: a transparent structure; aplurality of optoelectronic units arranged on the transparent structurein a sequence configuration, each of the plurality of optoelectronicunits comprising a side surface; a first bonding pad and a secondbonding pad formed on a top side of one of the plurality ofoptoelectronic units; a third bonding pad and a fourth bonding padformed on a top side of another of the plurality of optoelectronicunits; a plurality of conductive elements spaced apart from each other,wherein one of the plurality of conductive elements comprises a bottomsurface directly connecting the first bonding pad formed on the one ofthe plurality of optoelectronic units and the third bonding pad formedon the another of the plurality of optoelectronic units without coveringthe side surfaces of the one and the another of the plurality ofoptoelectronic units, and a top surface opposite to the bottom surface,wherein the transparent structure continuously covers the plurality ofoptoelectronic units and the plurality of conductive elements withoutdirectly contacting the top surfaces of the plurality of conductiveelements; a first terminal electrically connected to and locatedadjacent to a first of the plurality of optoelectronic units in thesequence configuration without overlapping with each other; and a secondterminal electrically connected to and located adjacent to a last of theplurality of optoelectronic units in the sequence configuration; and acover covering the filament.
 2. The light bulb of claim 1, furthercomprising a wavelength converting material arranged within thetransparent structure.
 3. The light bulb of claim 2, wherein thewavelength converting material directly covers the one of the pluralityof optoelectronic units.
 4. The light bulb of claim 2, wherein the oneof the plurality of optoelectronic units comprises a bottom sideopposite to the top side, and the wavelength converting material isarranged under the bottom side, and covers the side surface.
 5. Thelight bulb of claim 2, wherein each of the plurality of conductiveelements comprises an outer side surface which is not covered by thetransparent structure.
 6. The light bulb of claim 5, further comprisinganother wavelength converting material arranged on the top side of theone of the plurality of optoelectronic units.
 7. The light bulb of claim6, wherein each outer side surface of the the plurality of conductiveelements is not covered by the another wavelength converting material.8. The light bulb of claim 1, further comprising a second filamentcoupled to the base, and wherein the first filament and the secondfilament are not parallel with each other.
 9. The light bulb of claim 8,wherein at least one of the first filament and the second filament istilted relative to the base.
 10. The light bulb of claim 1, wherein thefirst filament and the second filament is not directly connected to thebase.
 11. The light bulb of claim 1, wherein each of the plurality ofconductive elements has a length larger than a corresponding one of theplurality of optoelectronic units.
 12. The light bulb of claim 8,wherein the first filament and the second filament face differentdirections.
 13. The light bulb of claim 1, wherein the transparentstructure is formed in a stripe shape.
 14. The light bulb of claim 1,wherein the transparent structure has a curved shape.
 15. The light bulbof claim 1, wherein the transparent structure has a melting point higherthan an operation temperature of the plurality of optoelectronic units.16. The light bulb of claim 1, wherein the transparent structuredirectly contacts the side surface of each of the plurality ofoptoelectronic units.
 17. The light bulb of claim 1, wherein the firstfilament is flexible.
 18. The light bulb of claim 1, wherein theplurality of optoelectronic units is embedded in the transparentstructure.
 19. The light bulb of claim 1, wherein the plurality ofoptoelectronic units is connected in series.
 20. The light bulb of claim1, wherein the plurality of optoelectronic units is connected inparallel.